HBM Design Architect

Lead architecture and feasibility assessments for emerging DRAM and HBM technologies, advanced packaging, hybrid bonding, and vertically integrated memory. Translate device, process, and packaging capabilities into product requirements for bandwidth, latency, power, density, thermals, and reliability. Identify technology gaps, define targets, develop de-risking plans, and lead system-technology co-optimization studies. Partner with multidisciplinary teams and present roadmap recommendations to technical leadership.