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Packaging Engineer (Chippewa Falls, WI)

  • Hewlett Packard Enterprise
  • Chippewa Falls, WI, USA
  • 74K-170K Annually

Develops and maintains crating, corrugated, and foam packaging solutions for HPE high-performance computing products. Leads fragility testing using shock, vibration, and drop-test equipment; analyzes results; recommends design improvements; prepares technical documentation and laboratory reports; maintains BOM documentation for sustainability and compliance requirements; identifies cost savings; and supports manufacturing and service teams in resolving packaging issues.

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